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AS1113
Datasheet - D e t a i l e d D e s c r i p t i o n
Detailed Error Reports
The detailed error report can be read out after global error mode has been run. At the falling edge of LD, the detailed
error report of the selected test is latched into the shift register and can be clocked out with n *16 clock cycles ( n is the
number of AS1113s in a chain) via pin SDO. At the same time new data can be written into the shift register, which is
loaded on the next rising edge of pin LD. This pattern is shown at the output drivers, at the falling edge of OEN.
Detailed Temperature Warning Report
The detailed temperature warning report can be read out immediately after global error mode has been run. SDI must
be 1 for the first device. Bit0 of the 16bit data word represents the temperature flag of the chip.
Figure 13. Detailed Temperature Warning Report Timing Diagram
OEN
LD
CLK
Global Flag Readout
t GSW(ERROR)
t (SU)ERROR
t H(L)
t P4
Detailed Error Report Readout
SDI
DBit15
DBit14 DBit13 DBit12
DBitn
DBit2
DBit1
DBit0
Don’t
Care
New Data Input
SDO
t P4
T FLAG
Undefined
Temperature Error Report Output
TBit0
t P1
Don’t
Care
For detailed timing information see Timing Diagrams on page 9 .
Detailed Temperature Warning Report Example
Consider a case where four AS1113s are cascaded in one chain. The detailed error report lists the temperatures for
each device in the chain:
IC1:[70°] IC2:[85°] IC3:[170°] IC4:[60°]
In this case, IC3 is overheated and will generate a global error, and therefore 4*16 clock cycles are needed to write out
the detailed temperature warning report, and optionally read in new data. The detailed temperature warning report
would look like this:
XXXXXXXXXXXXXXX1 XXXXXXXXXXXXXXX1 XXXXXXXXXXXXXXX0 XXXXXXXXXXXXXXX1
The 0 in the detailed temperature warning report indicates that IC3 is the device with the over-temperature condition.
Note: In an actual report there are no spaces in the output.
www.austriamicrosystems.com/LED-Driver-ICs/AS1113
Revision 1.04
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